Job description
Minimum qualifications:
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience.
- 4 years of experience in a semiconductor R&D or manufacturing environment, or 3 years of experience with an advanced degree.
- 3 years of experience with PCB Design and in developing test / reliability / characterization hardware for semiconductor or optical devices.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field.
- 5 years of experience in test and reliability hardware development from planning to verification, preferably in a manufacturing or Research and Development (R&D) environment.
- 1 year of experience in technical leadership.
- Experience with various communication protocols (SPI, I2C, UART, Ethernet), firmware, and microprocessor implementation.
- Experience with Cadence/Allegro, Virtuoso.
- Proficiency in test software development including familiarity with SQL, C#, Python etc.
About the job
The Google Augmented Reality team is a diverse group of experts tasked with building the foundations for great immersive computing and building helpful, delightful user experiences. We're focused on making immersive computing accessible to billions of people through mobile devices, and our scope continues to grow and evolve.
Salary Range Info:
The US base salary range for this full-time position is $141,000-$212,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.
Responsibilities
- Design electrical boards required for microLED and microDisplay test, characterization, and Failure Analysis (FA) stations needed to support microLED technology roadmap.
- Perform electrical engineering tasks related to test/FA hardware design including ownership of PCB schematic, layout, and circuit signal integrity simulations.
- Create designs on multiple mediums (e,g.,multi-layer FPC, rigid multi-layer PCB, etc).
- Participate in tester design, debug, and production bring-up for microDisplay test/FA/characterization in several form factors (including on-wafer, on-display, and in-module).
- Develop the required reliability testing hardware for biased device reliability tests like High Temperature Operating Life (HTOL), Temperature Humidity Bias (THB).
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